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| TK20J60U TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (DTMOS ) TK20J60U Switching Regulator Applications 15.9 MAX. Unit: mm 3.2 0.2 1.0 4.5 9.0 2.0 3.3 MAX. 2.0 0.3 Characteristics Drain-source voltage Gate-source voltage DC Drain current (Note 1) Symbol VDSS VGSS ID IDP PD EAS IAR EAR Tch Tstg Rating 600 30 20 40 190 144 20 19 150 -55 to 150 Unit V V A W mJ A mJ C C 1.0 0.3 0.25 5.45 0.2 4.8 MAX. 2.8 1 2 3 5.45 0.2 1.8 MAX. 0.3 0.1 Pulse (t = 1 ms) (Note 1) Drain power dissipation (Tc = 25C) Single pulse avalanche energy (Note 2) Avalanche current Repetitive avalanche energy Channel temperature Storage temperature range (Note 3) 1. Gate 2. Drain(heat sink) 3. Source JEDEC JEITA TOSHIBA 0.6 SC-65 2-16C1B Weight : 4.6 g (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Thermal resistance, channel to case Thermal resistance, channel to ambient Symbol Rth (ch-c) Rth (ch-a) Max 0.658 50 Unit 2 C/W C/W Note 1: Please use devices on conditions that the channel temperature is below 150C. Note 2: VDD = 90 V, Tch = 25C (initial), L = 0.63 mH, RG = 25 , IAR = 20 A Note 3: Repetitive rating: pulse width limited by maximum channel temperature This transistor is an electrostatic sensitive device. Please handle with caution. 1 20.5 0.5 Absolute Maximum Ratings (Ta = 25C) 2.0 20.0 0.3 * * * * Low drain-source ON resistance: RDS (ON) = 0.165 (typ.) High forward transfer admittance: Yfs = 12 S (typ.) Low leakage current: IDSS = 100 A (VDS = 600 V) Enhancement-mode: Vth = 3.0~5.0 V (VDS = 10 V, ID = 1 mA) 3 1 2008-06-11 TK20J60U Electrical Characteristics (Ta = 25C) Characteristics Gate leakage current Drain cut-off current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-on time Switching time Fall time Turn-off time Total gate charge Gate-source charge Gate-drain charge tf toff Qg Qgs Qgd VDD 400 V, VGS = 10 V, ID = 20 A Duty 1%, tw = 10 s Symbol IGSS IDSS V (BR) DSS Vth RDS (ON) Yfs Ciss Crss Coss tr ton 10 V VGS 0V 50 ID = 10A VOUT VDS = 10 V, VGS = 0 V, f = 1 MHz Test Condition VGS = 30 V, VDS = 0 V VDS = 600 V, VGS = 0 V ID = 10 mA, VGS = 0 V VDS = 10 V, ID = 1 mA VGS = 10 V, ID = 10 A VDS = 10 V, ID = 10 A Min 600 3.0 3.0 Typ. 0.165 12 1470 150 3500 40 80 12 100 27 16 11 Max 1 100 5.0 0.19 pF Unit A A V V S ns RL = 30 VDD 300 V nC Source-Drain Ratings and Characteristics (Ta = 25C) Characteristics Continuous drain reverse current (Note 1) Pulse drain reverse current Forward voltage (diode) Reverse recovery time Reverse recovery charge (Note 1) Symbol IDR IDRP VDSF trr Qrr Test Condition IDR = 20 A, VGS = 0 V IDR = 20 A, VGS = 0 V, dIDR/dt = 100 A/s Min Typ. 450 8.1 Max 20 40 -1.7 Unit A A V ns C Marking TOSHIBA K20J60U Part No. (or abbreviation code) Lot No. A line indicates Lead (Pb)-Free 2 2008-06-11 TK20J60U ID - VDS 20 Common source Tc = 25C Pulse test 40 8,10 7.5 7 32 10 ID - VDS 8 Common source Tc = 25C Pulse test 7.5 24 7 16 6.5 8 6 VGS = 5.5 V 5 0 0 10 20 30 40 50 16 (A) ID 12 6.5 8 6 Drain current 4 VGS = 5.5 V 0 0 1 2 3 4 Drain-source voltage VDS (V) Drain current ID (A) Drain-source voltage VDS (V) ID - VGS 40 Common source VDS = 20 V Pulse test 10 VDS - VGS Common source Tc = 25C Pulse test 32 (V) 8 (A) ID 16 Drain-source voltage 24 VDS 6 100 25 Tc = -55C 4 Drain current ID = 20A 8 2 10 5 0 0 2 4 6 8 10 0 0 4 8 12 16 20 Gate-source voltage VGS (V) Gate-source voltage VGS (V) Yfs - ID 100 Common source VDS = 10 V Pulse test 1 Common source Tc = 25C Pulse test RDS (ON) - ID Tc = -55C 100 25 10 Drain-source ON-resistance RDS (ON) () Forward transfer admittance Yfs (S) VGS = 10,15 V 0.1 1 0.1 0.1 1 10 100 0.01 0.1 1 10 100 Drain current ID (A) Drain current ID (A) 3 2008-06-11 TK20J60U RDS (ON) - Tc 0.5 IDR - VDS 100 Common source Tc = 25C Pulse test Drain-source ON-resistance RDS (ON) () 0.4 ID = 20 A 0.3 10 5 0.2 IDR Drain reverse current (A) 10 Common source VGS = 10 V Pulse test 10 5 1 3 0.1 1 0.1 0 VGS = 0 V 0.8 1.2 1.6 0 -80 -40 0 40 80 120 160 0.4 Case temperature Tc (C) Drain-source voltage VDS (V) C - VDS 100000 5 Vth - Tc Vth (V) Gate threshold voltage Ciss Ciss Coss Coss 10000 (pF) 4 1000 3 Capacitance C 100 2 10 Common source VGS = 0 V f = 1 MHz Tc = 25C 1 0.1 1 Crss Crss 1 Common source VDS = 10 V ID = 1 mA Pulse test -40 0 40 80 120 160 10 100 0 -80 Drain-source voltage VDS (V) Case temperature Tc (C) PD - Tc 250 500 Dynamic input/output characteristics 20 Common source ID = 20 A Tc = 25C Pulse test 16 200V 300 VDD = 100V 12 400V 8 VGS 100 4 (W) (V) 200 PD VDS 400 VDS Drain power dissipation Drain-source voltage 100 200 50 0 0 40 80 120 160 0 0 10 20 30 40 0 Case temperature Tc (C) Total gate charge Qg (nC) 4 2008-06-11 Gate-source voltage 150 VGS (V) TK20J60U rth - tw Normalized transient thermal impedance rth (t)/Rth (ch-c) 10 1 Duty=0.5 0.2 0.1 0.1 0.05 Single pulse 0.01 PDM t T Duty = t/T Rth (ch-c) = 0.658C/W 100 1 10 100 1 10 0.02 0.01 10 Pulse width tw (s) Safe operating area 100 200 ID max (Pulse) * ID max (Continuous) 10 1 ms * DC operation Tc = 25C 100 s * EAS - Tch EAS (mJ) Avalanche energy 160 (A) ID 1 120 Drain current 80 0.1 * Single nonrepetitive pulse Tc = 25C Curves must be derated linearly with increase in temperature. 0.001 0.1 1 10 40 0.01 VDSS max 100 1000 0 25 50 75 100 125 150 Channel temperature (initial) Tch (C) Drain-source voltage VDS (V) 15 V -15 V BVDSS IAR VDD VDS WAVEFORM TEST CIRCUIT RG = 25 VDD = 90 V, L = 0.63 mH AS = 1 B VDSS L I2 B 2 - VDD VDSS 5 2008-06-11 TK20J60U RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 20070701-EN * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2008-06-11 |
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